5962-3832504BRX
vs
SN74LS377JDS
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
MOTOROLA INC
Part Package Code
DIP
DIP
Package Description
DIP,
DIP, DIP20,.3
Pin Count
20
20
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
LS
LS
JESD-30 Code
R-GDIP-T20
R-CDIP-T20
Logic IC Type
D FLIP-FLOP
D FLIP-FLOP
Number of Bits
1
8
Number of Functions
1
1
Number of Terminals
20
20
Operating Temperature-Max
125 °C
70 °C
Operating Temperature-Min
-55 °C
Output Polarity
TRUE
TRUE
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC, METAL-SEALED COFIRED
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Propagation Delay (tpd)
42 ns
27 ns
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Max (Vsup)
5.5 V
5.25 V
Supply Voltage-Min (Vsup)
4.5 V
4.75 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
TTL
TTL
Temperature Grade
MILITARY
COMMERCIAL
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Position
DUAL
DUAL
Trigger Type
POSITIVE EDGE
POSITIVE EDGE
fmax-Min
25 MHz
40 MHz
Base Number Matches
1
3
Additional Feature
WITH HOLD MODE
JESD-609 Code
e0
Length
24.515 mm
Package Equivalence Code
DIP20,.3
Seated Height-Max
5.08 mm
Terminal Finish
TIN LEAD
Terminal Pitch
2.54 mm
Width
7.62 mm
Compare 5962-3832504BRX with alternatives
Compare SN74LS377JDS with alternatives