5962-3830303BCX
vs
HD74LS266P
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NATIONAL SEMICONDUCTOR CORP
RENESAS ELECTRONICS CORP
Package Description
DIP,
6.30 X 19.20 MM, 2.54 MM PITCH, PLASTIC, DIP-14
Reach Compliance Code
unknown
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Family
LS
LS
JESD-30 Code
R-GDIP-T14
R-PDIP-T14
Logic IC Type
XNOR GATE
XNOR GATE
Number of Functions
4
4
Number of Inputs
2
2
Number of Terminals
14
14
Operating Temperature-Max
125 °C
75 °C
Operating Temperature-Min
-55 °C
-20 °C
Output Characteristics
OPEN-COLLECTOR
OPEN-COLLECTOR
Package Body Material
CERAMIC, GLASS-SEALED
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Propagation Delay (tpd)
56 ns
30 ns
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Max (Vsup)
5.5 V
5.25 V
Supply Voltage-Min (Vsup)
4.5 V
4.75 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
TTL
TTL
Temperature Grade
MILITARY
COMMERCIAL EXTENDED
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Position
DUAL
DUAL
Base Number Matches
3
2
Part Package Code
DIP
Pin Count
14
Length
19.2 mm
Seated Height-Max
5.06 mm
Terminal Pitch
2.54 mm
Width
7.62 mm
Compare 5962-3830303BCX with alternatives
Compare HD74LS266P with alternatives