5962-3830107BEX vs JM38510/30107BEA feature comparison

5962-3830107BEX NXP Semiconductors

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JM38510/30107BEA Motorola Semiconductor Products

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS MOTOROLA INC
Part Package Code DIP
Package Description DIP, CERDIP-16
Pin Count 16
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family LS LS
JESD-30 Code R-GDIP-T16 R-GDIP-T16
Logic IC Type D FLIP-FLOP D FLIP-FLOP
Number of Bits 1 4
Number of Functions 4 1
Number of Terminals 16 16
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Output Polarity COMPLEMENTARY COMPLEMENTARY
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Propagation Delay (tpd) 55 ns 55 ns
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology TTL TTL
Temperature Grade MILITARY MILITARY
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Trigger Type POSITIVE EDGE POSITIVE EDGE
fmax-Min 25 MHz 25 MHz
Base Number Matches 1 4
Length 19.3 mm
Seated Height-Max 4.19 mm
Terminal Pitch 2.54 mm
Width 7.62 mm

Compare 5962-3830107BEX with alternatives

Compare JM38510/30107BEA with alternatives