5962-3830101B2X
vs
HD74HC78RPEL
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MOTOROLA INC
RENESAS ELECTRONICS CORP
Package Description
QCCN,
SOP, SOP14,.25
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
LS
HC/UH
JESD-30 Code
S-XQCC-N20
R-PDSO-G14
Logic IC Type
J-K FLIP-FLOP
J-K FLIP-FLOP
Number of Bits
2
2
Number of Functions
2
1
Number of Terminals
20
14
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-55 °C
-40 °C
Output Polarity
COMPLEMENTARY
COMPLEMENTARY
Package Body Material
UNSPECIFIED
PLASTIC/EPOXY
Package Code
QCCN
SOP
Package Equivalence Code
LCC20,.35SQ
SOP14,.25
Package Shape
SQUARE
RECTANGULAR
Package Style
CHIP CARRIER
SMALL OUTLINE
Propagation Delay (tpd)
42 ns
190 ns
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Max (Vsup)
5.5 V
6 V
Supply Voltage-Min (Vsup)
4.5 V
2 V
Supply Voltage-Nom (Vsup)
5 V
4.5 V
Surface Mount
YES
YES
Technology
TTL
CMOS
Temperature Grade
MILITARY
INDUSTRIAL
Terminal Form
NO LEAD
GULL WING
Terminal Position
QUAD
DUAL
Trigger Type
NEGATIVE EDGE
NEGATIVE EDGE
fmax-Min
25 MHz
Base Number Matches
2
1
Pbfree Code
Rohs Code
Part Package Code
SOIC
Pin Count
14
Length
8.65 mm
Load Capacitance (CL)
50 pF
Max Frequency@Nom-Sup
24000000 Hz
Max I(ol)
0.004 A
Moisture Sensitivity Level
1
Packing Method
TR
Seated Height-Max
1.75 mm
Terminal Pitch
1.27 mm
Width
3.95 mm
Compare 5962-3830101B2X with alternatives
Compare HD74HC78RPEL with alternatives