5962-3829466MYX vs FT6164L-25L32MBLF feature comparison

5962-3829466MYX Pyramid Semiconductor Corporation

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FT6164L-25L32MBLF Force Technologies Ltd

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Part Life Cycle Code Active Active
Ihs Manufacturer PYRAMID SEMICONDUCTOR CORP FORCE TECHNOLOGIES LTD
Package Description CC-32 QCCN,
Reach Compliance Code compliant compliant
ECCN Code 3A001.A.2.C 3A001.A.2.C
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 25 ns 25 ns
JESD-30 Code R-CQCC-N32 R-CQCC-N32
Memory Density 65536 bit 65536 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 32 32
Number of Words 8192 words 8192 words
Number of Words Code 8000 8000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Organization 8KX8 8KX8
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package Code QCCN QCCN
Package Shape RECTANGULAR RECTANGULAR
Package Style CHIP CARRIER CHIP CARRIER
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Screening Level MIL-STD-883 MIL-STD-883
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Form NO LEAD NO LEAD
Terminal Position QUAD QUAD
Base Number Matches 1 1
Rohs Code Yes
Part Package Code QFJ
Pin Count 32
Length 13.97 mm
Peak Reflow Temperature (Cel) NOT SPECIFIED
Seated Height-Max 1.905 mm
Supply Current-Max 0.155 mA
Terminal Pitch 1.27 mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 11.43 mm

Compare 5962-3829466MYX with alternatives

Compare FT6164L-25L32MBLF with alternatives