5962-3829454MZX vs IDT7164S35TCB feature comparison

5962-3829454MZX Micross Components

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IDT7164S35TCB Integrated Device Technology Inc

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer AUSTIN SEMICONDUCTOR INC INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code DIP DIP
Package Description CERAMIC, DIP-28 0.300 INCH, THIN, SIDE BRAZED, DIP-28
Pin Count 28 28
Reach Compliance Code unknown not_compliant
ECCN Code 3A001.A.2.C 3A001.A.2.C
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 35 ns 35 ns
JESD-30 Code R-GDIP-T28 R-CDIP-T28
Memory Density 65536 bit 65536 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 28 28
Number of Words 8192 words 8192 words
Number of Words Code 8000 8000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Organization 8KX8 8KX8
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, METAL-SEALED COFIRED
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Base Number Matches 2 1
Pbfree Code No
Rohs Code No
I/O Type COMMON
JESD-609 Code e0
Length 35.56 mm
Number of Ports 1
Output Characteristics 3-STATE
Output Enable YES
Package Equivalence Code DIP28,.3
Screening Level 38535Q/M;38534H;883B
Seated Height-Max 5.08 mm
Standby Current-Max 0.02 A
Standby Voltage-Min 4.5 V
Supply Current-Max 0.16 mA
Terminal Finish TIN LEAD
Terminal Pitch 2.54 mm
Width 7.62 mm

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