5962-3829453MXA vs 5962-8969102ZA feature comparison

5962-3829453MXA Pyramid Semiconductor Corporation

Buy Now

5962-8969102ZA QP Semiconductor

Buy Now
Part Life Cycle Code Active Transferred
Ihs Manufacturer PYRAMID SEMICONDUCTOR CORP QP SEMICONDUCTOR INC
Part Package Code DIP
Package Description DIP, DIP28,.6 DIP,
Pin Count 28
Reach Compliance Code compliant unknown
ECCN Code 3A001.A.2.C 3A001.A.2.C
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 35 ns 25 ns
I/O Type COMMON
JESD-30 Code R-GDIP-T28 R-GDIP-T28
JESD-609 Code e0 e0
Memory Density 65536 bit 65536 bit
Memory IC Type OTHER SRAM STANDARD SRAM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 28 28
Number of Words 8192 words 8192 words
Number of Words Code 8000 8000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Organization 8KX8 8KX8
Output Characteristics 3-STATE
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Equivalence Code DIP28,.6
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Screening Level MIL-STD-883
Standby Current-Max 0.0003 A
Standby Voltage-Min 2 V
Supply Current-Max 0.155 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Finish TIN LEAD TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Base Number Matches 1 4
Additional Feature AUTOMATIC POWER-DOWN
Length 37.0205 mm
Seated Height-Max 5.08 mm
Width 7.62 mm

Compare 5962-3829453MXA with alternatives

Compare 5962-8969102ZA with alternatives