5962-3829453MXA vs 5962-9461108H9A feature comparison

5962-3829453MXA Pyramid Semiconductor Corporation

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5962-9461108H9A White Microelectronics

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Part Life Cycle Code Active Obsolete
Ihs Manufacturer PYRAMID SEMICONDUCTOR CORP WHITE MICROELECTRONICS
Part Package Code DIP
Package Description DIP, DIP28,.6 CERAMIC, QFP-68
Pin Count 28
Reach Compliance Code compliant unknown
ECCN Code 3A001.A.2.C 3A001.A.2.C
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 35 ns 25 ns
I/O Type COMMON
JESD-30 Code R-GDIP-T28 S-CQMA-G68
JESD-609 Code e0 e0
Memory Density 65536 bit 16777216 bit
Memory IC Type OTHER SRAM SRAM MODULE
Memory Width 8 32
Number of Functions 1 1
Number of Terminals 28 68
Number of Words 8192 words 524288 words
Number of Words Code 8000 512000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Organization 8KX8 512KX32
Output Characteristics 3-STATE
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, METAL-SEALED COFIRED
Package Code DIP
Package Equivalence Code DIP28,.6
Package Shape RECTANGULAR SQUARE
Package Style IN-LINE MICROELECTRONIC ASSEMBLY
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Screening Level MIL-STD-883
Standby Current-Max 0.0003 A
Standby Voltage-Min 2 V
Supply Current-Max 0.155 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Finish TIN LEAD TIN LEAD
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm
Terminal Position DUAL QUAD
Base Number Matches 1 1
Additional Feature IT CAN ALSO BE CONFIGURED AS 2M X 8
Alternate Memory Width 16

Compare 5962-3829453MXA with alternatives

Compare 5962-9461108H9A with alternatives