5962-3829453MXA vs 5962-9318701H4X feature comparison

5962-3829453MXA Pyramid Semiconductor Corporation

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5962-9318701H4X Mercury Systems Inc

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Part Life Cycle Code Active Active
Ihs Manufacturer PYRAMID SEMICONDUCTOR CORP MERCURY SYSTEMS INC
Part Package Code DIP
Package Description DIP, DIP28,.6 HIP,
Pin Count 28
Reach Compliance Code compliant compliant
ECCN Code 3A001.A.2.C 3A001.A.2.C
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 35 ns 120 ns
I/O Type COMMON
JESD-30 Code R-GDIP-T28 S-XHIP-P66
JESD-609 Code e0
Memory Density 65536 bit 4194304 bit
Memory IC Type OTHER SRAM SRAM MODULE
Memory Width 8 32
Number of Functions 1 1
Number of Terminals 28 66
Number of Words 8192 words 131072 words
Number of Words Code 8000 128000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Organization 8KX8 128KX32
Output Characteristics 3-STATE
Package Body Material CERAMIC, GLASS-SEALED UNSPECIFIED
Package Code DIP HIP
Package Equivalence Code DIP28,.6
Package Shape RECTANGULAR SQUARE
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Screening Level MIL-STD-883 MIL-STD-883
Standby Current-Max 0.0003 A
Standby Voltage-Min 2 V
Supply Current-Max 0.155 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE PIN/PEG
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL HEX
Base Number Matches 1 1
Additional Feature USER CONFIGURABLE AS 512K X 8
Alternate Memory Width 16
Length 27.3 mm
Seated Height-Max 4.95 mm
Width 27.3 mm

Compare 5962-3829453MXA with alternatives

Compare 5962-9318701H4X with alternatives