5962-3829446MTA
vs
5962-9461108H9A
feature comparison
Rohs Code |
No
|
|
Part Life Cycle Code |
Active
|
Obsolete
|
Ihs Manufacturer |
PYRAMID SEMICONDUCTOR CORP
|
WHITE MICROELECTRONICS
|
Part Package Code |
DFP
|
|
Package Description |
DFP, FL28,.4
|
CERAMIC, QFP-68
|
Pin Count |
28
|
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
3A001.A.2.C
|
3A001.A.2.C
|
HTS Code |
8542.32.00.41
|
8542.32.00.41
|
Access Time-Max |
12 ns
|
25 ns
|
I/O Type |
COMMON
|
|
JESD-30 Code |
R-GDFP-F28
|
S-CQMA-G68
|
Memory Density |
65536 bit
|
16777216 bit
|
Memory IC Type |
STANDARD SRAM
|
SRAM MODULE
|
Memory Width |
8
|
32
|
Number of Functions |
1
|
1
|
Number of Terminals |
28
|
68
|
Number of Words |
8192 words
|
524288 words
|
Number of Words Code |
8000
|
512000
|
Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-55 °C
|
-55 °C
|
Organization |
8KX8
|
512KX32
|
Output Characteristics |
3-STATE
|
|
Package Body Material |
CERAMIC, GLASS-SEALED
|
CERAMIC, METAL-SEALED COFIRED
|
Package Code |
DFP
|
|
Package Equivalence Code |
FL28,.4
|
|
Package Shape |
RECTANGULAR
|
SQUARE
|
Package Style |
FLATPACK
|
MICROELECTRONIC ASSEMBLY
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Screening Level |
MIL-PRF-38535
|
|
Standby Current-Max |
0.0002 A
|
|
Standby Voltage-Min |
2 V
|
|
Supply Current-Max |
0.18 mA
|
|
Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
MILITARY
|
MILITARY
|
Terminal Form |
FLAT
|
GULL WING
|
Terminal Pitch |
1.27 mm
|
|
Terminal Position |
DUAL
|
QUAD
|
Base Number Matches |
1
|
1
|
Additional Feature |
|
IT CAN ALSO BE CONFIGURED AS 2M X 8
|
Alternate Memory Width |
|
16
|
JESD-609 Code |
|
e0
|
Terminal Finish |
|
TIN LEAD
|
|
|
|
Compare 5962-3829446MTA with alternatives
Compare 5962-9461108H9A with alternatives