5962-3829425MZX vs WS128K32L-15G1UCA feature comparison

5962-3829425MZX Micross Components

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WS128K32L-15G1UCA White Electronic Designs Corp

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer AUSTIN SEMICONDUCTOR INC WHITE ELECTRONIC DESIGNS CORP
Part Package Code DIP
Package Description DIP, 23.90 MM, 3.57 MM HEIGHT, CERAMIC, QFP-68
Pin Count 28
Reach Compliance Code unknown unknown
ECCN Code 3A001.A.2.C
HTS Code 8542.32.00.41
Access Time-Max 45 ns 15 ns
JESD-30 Code R-GDIP-T28 S-CQFP-G68
Memory Density 65536 bit 4194304 bit
Memory IC Type STANDARD SRAM SRAM MODULE
Memory Width 8 32
Number of Functions 1 1
Number of Terminals 28 68
Number of Words 8192 words 131072 words
Number of Words Code 8000 128000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 70 °C
Operating Temperature-Min -55 °C
Organization 8KX8 128KX32
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, METAL-SEALED COFIRED
Package Code DIP QFP
Package Shape RECTANGULAR SQUARE
Package Style IN-LINE FLATPACK
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade MILITARY COMMERCIAL
Terminal Form THROUGH-HOLE GULL WING
Terminal Position DUAL QUAD
Base Number Matches 3 1
Rohs Code No
Additional Feature USER CONFIGURABLE AS 512K X 8
Alternate Memory Width 16
Length 23.88 mm
Peak Reflow Temperature (Cel) NOT SPECIFIED
Seated Height-Max 3.56 mm
Terminal Pitch 1.27 mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 23.88 mm

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Compare WS128K32L-15G1UCA with alternatives