5962-3829418MZX
vs
P4C164L-15DMLF
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
LOGIC DEVICES INC
PYRAMID SEMICONDUCTOR CORP
Part Package Code
DIP
DIP
Package Description
CERAMIC, DIP-28
0.300 INCH, ROHS COMPLIANT, CERAMIC, DIP-28
Pin Count
28
28
Reach Compliance Code
unknown
compliant
ECCN Code
3A001.A.2.C
3A001.A.2.C
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
15 ns
15 ns
JESD-30 Code
R-GDIP-T28
R-CDIP-T28
Memory Density
65536 bit
65536 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
28
28
Number of Words
8192 words
8192 words
Number of Words Code
8000
8000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Organization
8KX8
8KX8
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC, METAL-SEALED COFIRED
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-PRF-38535
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Position
DUAL
DUAL
Base Number Matches
3
1
Pbfree Code
Rohs Code
Additional Feature
LG-MAX
Length
37.719 mm
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Seated Height-Max
5.715 mm
Supply Current-Max
0.17 mA
Terminal Pitch
2.54 mm
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
7.62 mm
Compare 5962-3829418MZX with alternatives
Compare P4C164L-15DMLF with alternatives