Findchips: Compare 5962-3829417MYX vs FT6164L-20L32MBLF

5962-3829417MYX vs FT6164L-20L32MBLF feature comparison

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Buy Now Datasheet

Part Life Cycle Code	Transferred	Active
Ihs Manufacturer	QP SEMICONDUCTOR INC	FORCE TECHNOLOGIES LTD
Part Package Code	QFJ	QFJ
Package Description	QCCN,	QCCN,
Pin Count	32	32
Reach Compliance Code	unknown	compliant
ECCN Code	3A001.A.2.C	3A001.A.2.C
HTS Code	8542.32.00.41	8542.32.00.41
Access Time-Max	20 ns	20 ns
JESD-30 Code	R-CQCC-N32	R-CQCC-N32
Memory Density	65536 bit	65536 bit
Memory IC Type	STANDARD SRAM	STANDARD SRAM
Memory Width	8	8
Number of Functions	1	1
Number of Terminals	32	32
Number of Words	8192 words	8192 words
Number of Words Code	8000	8000
Operating Mode	ASYNCHRONOUS	ASYNCHRONOUS
Operating Temperature-Max	125 °C	125 °C
Operating Temperature-Min	-55 °C	-55 °C
Organization	8KX8	8KX8
Package Body Material	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED
Package Code	QCCN	QCCN
Package Shape	RECTANGULAR	RECTANGULAR
Package Style	CHIP CARRIER	CHIP CARRIER
Parallel/Serial	PARALLEL	PARALLEL
Qualification Status	Not Qualified	Not Qualified
Supply Voltage-Max (Vsup)	5.5 V	5.5 V
Supply Voltage-Min (Vsup)	4.5 V	4.5 V
Supply Voltage-Nom (Vsup)	5 V	5 V
Surface Mount	YES	YES
Technology	CMOS	CMOS
Temperature Grade	MILITARY	MILITARY
Terminal Form	NO LEAD	NO LEAD
Terminal Position	QUAD	QUAD
Base Number Matches	9	1
Rohs Code		Yes
Length		13.97 mm
Peak Reflow Temperature (Cel)		NOT SPECIFIED
Screening Level		MIL-STD-883
Seated Height-Max		1.905 mm
Supply Current-Max		0.16 mA
Terminal Pitch		1.27 mm
Time@Peak Reflow Temperature-Max (s)		NOT SPECIFIED
Width		11.43 mm
	Memory » SRAMs	Memory » SRAMs