5962-3829415MZA
vs
5962-9559505HMC
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
MATRA DESIGN SEMICONDUCTOR
|
WHITE ELECTRONIC DESIGNS CORP
|
| Package Description |
DIP-28
|
QFP, QFP68,1.1SQ,50
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
3A001.A.2.C
|
3A001.A.2.C
|
| HTS Code |
8542.32.00.41
|
8542.32.00.41
|
| Access Time-Max |
25 ns
|
55 ns
|
| I/O Type |
COMMON
|
COMMON
|
| JESD-30 Code |
R-XDIP-T28
|
S-XQFP-G68
|
| JESD-609 Code |
e0
|
|
| Memory Density |
65536 bit
|
4194304 bit
|
| Memory IC Type |
STANDARD SRAM
|
SRAM MODULE
|
| Memory Width |
8
|
32
|
| Number of Terminals |
28
|
68
|
| Number of Words |
8192 words
|
131072 words
|
| Number of Words Code |
8000
|
128000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Organization |
8KX8
|
128KX32
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Package Body Material |
CERAMIC
|
CERAMIC
|
| Package Code |
DIP
|
QFP
|
| Package Equivalence Code |
DIP28,.3
|
QFP68,1.1SQ,50
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
IN-LINE
|
FLATPACK
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Screening Level |
38535Q/M;38534H;883B
|
38535Q/M;38534H;883B
|
| Standby Current-Max |
0.02 A
|
0.0116 A
|
| Standby Voltage-Min |
4.5 V
|
2 V
|
| Supply Current-Max |
0.135 mA
|
0.6 mA
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
MILITARY
|
| Terminal Finish |
Tin/Lead (Sn/Pb) - hot dipped
|
|
| Terminal Form |
THROUGH-HOLE
|
GULL WING
|
| Terminal Pitch |
2.54 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
QUAD
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare 5962-3829415MZA with alternatives
Compare 5962-9559505HMC with alternatives