5962-3829415MTX
vs
P4C164L-25FI
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Active
Ihs Manufacturer
PYRAMID SEMICONDUCTOR CORP
PYRAMID SEMICONDUCTOR CORP
Part Package Code
DFP
DFP
Package Description
DFP,
CERAMIC, DFP-28
Pin Count
28
28
Reach Compliance Code
compliant
compliant
ECCN Code
3A001.A.2.C
EAR99
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
25 ns
25 ns
JESD-30 Code
R-GDFP-F28
R-CDFP-F28
Length
18.288 mm
18.542 mm
Memory Density
65536 bit
65536 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
28
28
Number of Words
8192 words
8192 words
Number of Words Code
8000
8000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-55 °C
-40 °C
Organization
8KX8
8KX8
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC, METAL-SEALED COFIRED
Package Code
DFP
DFP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
FLATPACK
FLATPACK
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Screening Level
MIL-STD-883
Seated Height-Max
2.921 mm
2.286 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
INDUSTRIAL
Terminal Form
FLAT
FLAT
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Width
12.446 mm
9.017 mm
Base Number Matches
3
1
Rohs Code
Additional Feature
LG-MAX
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Supply Current-Max
0.155 mA
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare 5962-3829415MTX with alternatives
Compare P4C164L-25FI with alternatives