5962-3829411MYX
vs
5962-9559511HMX
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
PYRAMID SEMICONDUCTOR CORP
WHITE ELECTRONIC DESIGNS CORP
Part Package Code
QFJ
Package Description
QCCN,
22.40 X 22.40 MM, CERAMIC, QFP-68
Pin Count
32
Reach Compliance Code
compliant
unknown
ECCN Code
3A001.A.2.C
3A001.A.2.C
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
45 ns
15 ns
JESD-30 Code
R-CQCC-N32
S-CQFP-G68
JESD-609 Code
e0
Memory Density
65536 bit
4194304 bit
Memory IC Type
STANDARD SRAM
SRAM MODULE
Memory Width
8
32
Number of Functions
1
1
Number of Terminals
32
68
Number of Words
8192 words
131072 words
Number of Words Code
8000
128000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Organization
8KX8
128KX32
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Code
QCCN
QFP
Package Shape
RECTANGULAR
SQUARE
Package Style
CHIP CARRIER
FLATPACK
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-STD-883
MIL-STD-883
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Finish
TIN LEAD
Terminal Form
NO LEAD
GULL WING
Terminal Position
QUAD
QUAD
Base Number Matches
12
4
Rohs Code
Additional Feature
USER CONFIGURABLE AS 512K X 8
Length
22.36 mm
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Seated Height-Max
3.51 mm
Terminal Pitch
1.27 mm
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
22.36 mm
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