5962-3829410MYA
vs
5962-9559511HAX
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
AUSTIN SEMICONDUCTOR INC
MICROSEMI CORP
Part Package Code
QFJ
Package Description
QCCN, LCC32,.45X.55
QFP,
Pin Count
32
Reach Compliance Code
unknown
compliant
ECCN Code
3A001.A.2.C
3A001.A.2.C
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
45 ns
15 ns
I/O Type
COMMON
JESD-30 Code
R-CQCC-N32
S-CQFP-G68
JESD-609 Code
e0
e4
Memory Density
65536 bit
4194304 bit
Memory IC Type
STANDARD SRAM
SRAM MODULE
Memory Width
8
32
Number of Functions
1
1
Number of Terminals
32
68
Number of Words
8192 words
131072 words
Number of Words Code
8000
128000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Organization
8KX8
128KX32
Output Characteristics
3-STATE
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Code
QCCN
QFP
Package Equivalence Code
LCC32,.45X.55
Package Shape
RECTANGULAR
SQUARE
Package Style
CHIP CARRIER
FLATPACK
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-STD-883
MIL-STD-883
Standby Current-Max
0.0003 A
Standby Voltage-Min
2 V
Supply Current-Max
0.105 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Finish
TIN LEAD
GOLD
Terminal Form
NO LEAD
GULL WING
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
QUAD
QUAD
Base Number Matches
4
3
Additional Feature
USER CONFIGURABLE AS 512K X 8
Length
22.36 mm
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Seated Height-Max
5.1 mm
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
22.36 mm
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