5962-3829410MXX
vs
5962-3829411MYX
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
INTEL CORP
LOGIC DEVICES INC
Part Package Code
DIP
QFJ
Package Description
CERAMIC, DIP-28
QCCN, LCC32,.45X.55
Pin Count
28
32
Reach Compliance Code
unknown
unknown
ECCN Code
3A001.A.2.C
3A001.A.2.C
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
45 ns
45 ns
JESD-30 Code
R-GDIP-T28
R-CQCC-N32
Memory Density
65536 bit
65536 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
28
32
Number of Words
8192 words
8192 words
Number of Words Code
8000
8000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Organization
8KX8
8KX8
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC, METAL-SEALED COFIRED
Package Code
DIP
QCCN
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
CHIP CARRIER
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-PRF-38535
MIL-STD-883
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Form
THROUGH-HOLE
NO LEAD
Terminal Position
DUAL
QUAD
Base Number Matches
1
1
Rohs Code
I/O Type
COMMON
JESD-609 Code
e0
Moisture Sensitivity Level
3
Output Characteristics
3-STATE
Package Equivalence Code
LCC32,.45X.55
Peak Reflow Temperature (Cel)
225
Standby Current-Max
0.02 A
Standby Voltage-Min
4.5 V
Supply Current-Max
0.125 mA
Terminal Finish
TIN LEAD
Terminal Pitch
1.27 mm
Compare 5962-3829410MXX with alternatives
Compare 5962-3829411MYX with alternatives