5962-3829410MXA
vs
AS8S128K32PN-15/IT
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
PERFORMANCE SEMICONDUCTOR CORP
MICROSS COMPONENTS
Part Package Code
DIP
PGA
Package Description
CERAMIC, DIP-28
PGA, PGA66,11X11
Pin Count
28
66
Reach Compliance Code
unknown
compliant
ECCN Code
3A001.A.2.C
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
45 ns
15 ns
I/O Type
COMMON
COMMON
JESD-30 Code
R-GDIP-T28
S-XPGA-P66
JESD-609 Code
e0
Memory Density
65536 bit
4194304 bit
Memory IC Type
OTHER SRAM
SRAM MODULE
Memory Width
8
32
Number of Functions
1
1
Number of Terminals
28
66
Number of Words
8192 words
131072 words
Number of Words Code
8000
128000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-55 °C
-40 °C
Organization
8KX8
128KX32
Output Characteristics
3-STATE
3-STATE
Package Body Material
CERAMIC, GLASS-SEALED
UNSPECIFIED
Package Code
DIP
PGA
Package Equivalence Code
DIP28,.6
PGA66,11X11
Package Shape
RECTANGULAR
SQUARE
Package Style
IN-LINE
GRID ARRAY
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-STD-883
Standby Current-Max
0.0003 A
0.006 A
Standby Voltage-Min
2 V
2 V
Supply Current-Max
0.105 mA
0.7 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
INDUSTRIAL
Terminal Finish
TIN LEAD
Terminal Form
THROUGH-HOLE
PIN/PEG
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
PERPENDICULAR
Base Number Matches
1
1
Additional Feature
ALSO CONFIGURABLE AS 512K X 8
Alternate Memory Width
16
Length
27.305 mm
Seated Height-Max
4.953 mm
Width
27.305 mm
Compare 5962-3829410MXA with alternatives
Compare AS8S128K32PN-15/IT with alternatives