5962-3829410MXA
vs
DPS128X32BV3-25M
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Active
Ihs Manufacturer
DEFENSE LOGISTICS AGENCY
TWILIGHT TECHNOLOGY INC
Package Description
CERAMIC, DIP-28
PGA, PGA66,11X11
Reach Compliance Code
unknown
unknown
Access Time-Max
45 ns
25 ns
JESD-30 Code
R-GDIP-T28
S-CPGA-P66
JESD-609 Code
e0
Memory Density
65536 bit
4194304 bit
Memory IC Type
OTHER SRAM
SRAM MODULE
Memory Width
8
32
Number of Functions
1
1
Number of Terminals
28
66
Number of Words
8192 words
131072 words
Number of Words Code
8000
128000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Organization
8KX8
128KX32
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC, METAL-SEALED COFIRED
Package Code
DIP
PGA
Package Shape
RECTANGULAR
SQUARE
Package Style
IN-LINE
GRID ARRAY
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Qualified
Not Qualified
Screening Level
MIL-STD-883
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Finish
TIN LEAD
Terminal Form
THROUGH-HOLE
PIN/PEG
Terminal Position
DUAL
PERPENDICULAR
Base Number Matches
1
1
Pbfree Code
Rohs Code
Part Package Code
PGA
Pin Count
66
ECCN Code
3A001.A.2.C
HTS Code
8542.32.00.41
Additional Feature
USER CONFIGURABLE AS 512K X 8
Alternate Memory Width
16
I/O Type
COMMON
Length
30.226 mm
Output Characteristics
3-STATE
Package Equivalence Code
PGA66,11X11
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Seated Height-Max
6.4008 mm
Standby Current-Max
0.0072 A
Standby Voltage-Min
2 V
Supply Current-Max
0.64 mA
Terminal Pitch
2.54 mm
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
30.226 mm
Compare 5962-3829410MXA with alternatives
Compare DPS128X32BV3-25M with alternatives