5962-3829407MZX
vs
P4C164-70CWMLF
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
E2V TECHNOLOGIES PLC
PYRAMID SEMICONDUCTOR CORP
Package Description
DIP,
DIP,
Reach Compliance Code
unknown
compliant
ECCN Code
3A001.A.2.C
3A001.A.2.C
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
70 ns
70 ns
JESD-30 Code
R-GDIP-T28
R-CDIP-T28
Length
37.1475 mm
37.846 mm
Memory Density
65536 bit
65536 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
28
28
Number of Words
8192 words
8192 words
Number of Words Code
8000
8000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Organization
8KX8
8KX8
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC, METAL-SEALED COFIRED
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Screening Level
MIL-PRF-38534 Class Q
Seated Height-Max
5.08 mm
5.08 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
15.24 mm
Base Number Matches
6
1
Rohs Code
Part Package Code
DIP
Pin Count
28
Additional Feature
LG-MAX
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Supply Current-Max
0.145 mA
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare 5962-3829407MZX with alternatives
Compare P4C164-70CWMLF with alternatives