5962-3829406MXX vs P4C164L-70L32MLF feature comparison

5962-3829406MXX Pyramid Semiconductor Corporation

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P4C164L-70L32MLF Pyramid Semiconductor Corporation

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Part Life Cycle Code Active Active
Ihs Manufacturer PYRAMID SEMICONDUCTOR CORP PYRAMID SEMICONDUCTOR CORP
Part Package Code DIP QFJ
Package Description DIP, 0.450 X 0.550 INCH, ROHS COMPLIANT, CERAMIC, LCC-32
Pin Count 28 32
Reach Compliance Code compliant compliant
ECCN Code 3A001.A.2.C 3A001.A.2.C
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 70 ns 70 ns
JESD-30 Code R-GDIP-T28 R-CQCC-N32
Memory Density 65536 bit 65536 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 28 32
Number of Words 8192 words 8192 words
Number of Words Code 8000 8000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Organization 8KX8 8KX8
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, METAL-SEALED COFIRED
Package Code DIP QCCN
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE CHIP CARRIER
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Screening Level MIL-STD-883
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Form THROUGH-HOLE NO LEAD
Terminal Position DUAL QUAD
Base Number Matches 3 1
Pbfree Code Yes
Rohs Code Yes
Length 13.97 mm
Peak Reflow Temperature (Cel) NOT SPECIFIED
Seated Height-Max 1.905 mm
Supply Current-Max 0.145 mA
Terminal Pitch 1.27 mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 11.43 mm

Compare 5962-3829406MXX with alternatives

Compare P4C164L-70L32MLF with alternatives