5962-3829406MXX
vs
P4C164-70PMB
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
ELECTRONIC DESIGNS INC
PYRAMID SEMICONDUCTOR CORP
Package Description
CERAMIC, DIP-28
DIP,
Reach Compliance Code
unknown
compliant
Access Time-Max
70 ns
70 ns
JESD-30 Code
R-GDIP-T28
R-PDIP-T28
Memory Density
65536 bit
65536 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
28
28
Number of Words
8192 words
8192 words
Number of Words Code
8000
8000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Organization
8KX8
8KX8
Package Body Material
CERAMIC, GLASS-SEALED
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-PRF-38535
MIL-STD-883 Class B
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Position
DUAL
DUAL
Base Number Matches
3
1
Rohs Code
Part Package Code
DIP
Pin Count
28
ECCN Code
3A001.A.2.C
HTS Code
8542.32.00.41
JESD-609 Code
e0
Length
34.8615 mm
Seated Height-Max
5.334 mm
Supply Current-Max
0.145 mA
Terminal Finish
Tin/Lead (Sn85Pb15)
Terminal Pitch
2.54 mm
Width
7.62 mm
Compare 5962-3829406MXX with alternatives
Compare P4C164-70PMB with alternatives