5962-3829406MXX
vs
IDT7164S70DB
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
PYRAMID SEMICONDUCTOR CORP
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
DIP
DIP
Package Description
DIP,
DIP, DIP28,.6
Pin Count
28
28
Reach Compliance Code
compliant
not_compliant
ECCN Code
3A001.A.2.C
3A001.A.2.C
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
70 ns
70 ns
JESD-30 Code
R-GDIP-T28
R-CDIP-T28
Memory Density
65536 bit
65536 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
28
28
Number of Words
8192 words
8192 words
Number of Words Code
8000
8000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Organization
8KX8
8KX8
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC, METAL-SEALED COFIRED
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-STD-883
MIL-STD-883 Class B
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Position
DUAL
DUAL
Base Number Matches
3
1
Pbfree Code
Rohs Code
Date Of Intro
1988-01-01
I/O Type
COMMON
JESD-609 Code
e0
Length
37.211 mm
Number of Ports
1
Output Characteristics
3-STATE
Output Enable
YES
Package Equivalence Code
DIP28,.6
Seated Height-Max
5.08 mm
Standby Current-Max
0.0002 A
Standby Voltage-Min
2 V
Supply Current-Max
0.16 mA
Terminal Finish
TIN LEAD
Terminal Pitch
2.54 mm
Width
15.24 mm
Compare 5962-3829406MXX with alternatives
Compare IDT7164S70DB with alternatives