5962-3826701MUX vs 5962-3826701MXX feature comparison

5962-3826701MUX Teledyne e2v

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5962-3826701MXX LSI Corporation

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Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer TELEDYNE E2V (UK) LTD SEEQ TECHNOLOGY INC
Part Package Code QFJ
Package Description QCCN, DIP,
Pin Count 32
Reach Compliance Code unknown unknown
ECCN Code 3A001.A.2.C 3A001.A.2.C
HTS Code 8542.32.00.51 8542.32.00.51
Access Time-Max 250 ns 250 ns
Additional Feature AUTOMATIC WRITE; DATA RETENTION: 10 YEARS AUTOMATIC WRITE; DATA RETENTION: 10 YEARS
Data Retention Time-Min 10 10
JESD-30 Code R-CQCC-N32 R-GDIP-T32
JESD-609 Code e0
Length 13.97 mm 42.2 mm
Memory Density 1048576 bit 1048576 bit
Memory IC Type EEPROM EEPROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 32 32
Number of Words 131072 words 131072 words
Number of Words Code 128000 128000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Organization 128KX8 128KX8
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, GLASS-SEALED
Package Code QCCN DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style CHIP CARRIER IN-LINE
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 5 V 5 V
Qualification Status Not Qualified Not Qualified
Screening Level MIL-STD-883 MIL-STD-883
Seated Height-Max 2.54 mm 5.72 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Finish TIN LEAD
Terminal Form NO LEAD THROUGH-HOLE
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position QUAD DUAL
Width 11.43 mm 15.24 mm
Write Cycle Time-Max (tWC) 10 ms 10 ms
Base Number Matches 4 6
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Current-Max 0.08 mA
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

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Compare 5962-3826701MXX with alternatives