5962-0422105VUX
vs
5962-0422106QUC
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
MICROSEMI CORP
MICROCHIP TECHNOLOGY INC
Package Description
QFP-256
CERAMIC, QFP-256
Reach Compliance Code
compliant
compliant
ECCN Code
3A001.A.2.C
3A001.A.2.C
HTS Code
8542.39.00.01
8542.39.00.01
JESD-30 Code
S-CQFP-F256
S-CQFP-F256
Length
36 mm
36 mm
Number of CLBs
21504
Number of Equivalent Gates
2000000
2000000
Number of Terminals
256
256
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Organization
21504 CLBS, 2000000 GATES
2000000 GATES
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Code
GQFF
HGQFF
Package Equivalence Code
TPAK256,3SQ,20
TPAK256,3SQ,20
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK, GUARD RING
FLATPACK, HEAT SINK/SLUG, GUARD RING
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-PRF-38535 Class V
MIL-PRF-38535 Class Q
Seated Height-Max
3.11 mm
3.11 mm
Supply Voltage-Max
1.575 V
1.575 V
Supply Voltage-Min
1.425 V
1.425 V
Supply Voltage-Nom
1.5 V
1.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Form
FLAT
FLAT
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
QUAD
QUAD
Width
36 mm
36 mm
Base Number Matches
2
3
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