5962-0422102VUC
vs
5962-0422102QUC
feature comparison
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
MICROSEMI CORP
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
QFP-256
|
CERAMIC, QFP-256
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
3A001.A.2.C
|
3A001.A.2.C
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| JESD-30 Code |
S-CQFP-F256
|
S-CQFP-F256
|
| Length |
36 mm
|
36 mm
|
| Number of CLBs |
21504
|
|
| Number of Equivalent Gates |
2000000
|
2000000
|
| Number of Terminals |
256
|
256
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Organization |
21504 CLBS, 2000000 GATES
|
2000000 GATES
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
GQFF
|
HGQFF
|
| Package Equivalence Code |
TPAK256,3SQ,20
|
TPAK256,3SQ,20
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK, GUARD RING
|
FLATPACK, HEAT SINK/SLUG, GUARD RING
|
| Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
| Qualification Status |
Qualified
|
Not Qualified
|
| Screening Level |
MIL-PRF-38535 Class V
|
MIL-PRF-38535 Class Q
|
| Seated Height-Max |
3.11 mm
|
3.11 mm
|
| Supply Voltage-Max |
1.575 V
|
1.575 V
|
| Supply Voltage-Min |
1.425 V
|
1.425 V
|
| Supply Voltage-Nom |
1.5 V
|
1.5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
MILITARY
|
| Terminal Form |
FLAT
|
FLAT
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
36 mm
|
36 mm
|
| Base Number Matches |
2
|
4
|
|
|
|
Compare 5962-0422102QUC with alternatives