5962-0421901QYC
vs
5962-0421903QYX
feature comparison
| Part Life Cycle Code |
Transferred
|
|
| Ihs Manufacturer |
MICROSEMI CORP
|
|
| Package Description |
HGQFF,
|
|
| Reach Compliance Code |
compliant
|
|
| ECCN Code |
3A001.A.2.C
|
|
| HTS Code |
8542.39.00.01
|
|
| JESD-30 Code |
S-CQFP-F208
|
|
| Length |
29.21 mm
|
|
| Number of Equivalent Gates |
250000
|
|
| Number of Terminals |
208
|
|
| Operating Temperature-Max |
125 °C
|
|
| Operating Temperature-Min |
-55 °C
|
|
| Organization |
250000 GATES
|
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
|
| Package Code |
HGQFF
|
|
| Package Equivalence Code |
TPAK208,2.9SQ,20
|
|
| Package Shape |
SQUARE
|
|
| Package Style |
FLATPACK, HEAT SINK/SLUG, GUARD RING
|
|
| Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
|
| Qualification Status |
Qualified
|
|
| Screening Level |
MIL-PRF-38535 Class Q
|
|
| Seated Height-Max |
3.11 mm
|
|
| Supply Voltage-Max |
1.575 V
|
|
| Supply Voltage-Min |
1.425 V
|
|
| Supply Voltage-Nom |
1.5 V
|
|
| Surface Mount |
YES
|
|
| Technology |
CMOS
|
|
| Temperature Grade |
MILITARY
|
|
| Terminal Form |
FLAT
|
|
| Terminal Pitch |
0.5 mm
|
|
| Terminal Position |
QUAD
|
|
| Width |
29.21 mm
|
|
| Base Number Matches |
3
|
|
|
|
|