5962-01-318-5506
vs
N74F08N
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
INTERSIL CORP
PHILIPS SEMICONDUCTORS
Package Description
DIP, DIP14,.3
DIP-14
Reach Compliance Code
not_compliant
unknown
HTS Code
8542.39.00.01
8542.39.00.01
JESD-30 Code
R-XDIP-T14
R-PDIP-T14
Load Capacitance (CL)
50 pF
Logic IC Type
AND GATE
AND GATE
Max I(ol)
0.004 A
0.02 A
Number of Terminals
14
14
Operating Temperature-Max
125 °C
70 °C
Operating Temperature-Min
-55 °C
Package Body Material
CERAMIC
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Equivalence Code
DIP14,.3
DIP14,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Prop. Delay@Nom-Sup
30 ns
6.6 ns
Qualification Status
Not Qualified
Not Qualified
Schmitt Trigger
NO
NO
Screening Level
38535Q/M;38534H;883B
Surface Mount
NO
NO
Technology
CMOS
TTL
Temperature Grade
MILITARY
COMMERCIAL
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Base Number Matches
2
4
JESD-609 Code
e4
Power Supply Current-Max (ICC)
12.9 mA
Supply Voltage-Nom (Vsup)
5 V
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
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