5962-01-316-4433
vs
I74F32D,623
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
INTERSIL CORP
NXP SEMICONDUCTORS
Package Description
DIP, DIP14,.3
SOP, SOP14,.25
Reach Compliance Code
not_compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
JESD-30 Code
R-PDIP-T14
R-PDSO-G14
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
OR GATE
OR GATE
Max I(ol)
0.004 A
0.02 A
Number of Terminals
14
14
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-55 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
SOP
Package Equivalence Code
DIP14,.3
SOP14,.25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
SMALL OUTLINE
Peak Reflow Temperature (Cel)
NOT SPECIFIED
260
Prop. Delay@Nom-Sup
36 ns
6.6 ns
Qualification Status
Not Qualified
Not Qualified
Schmitt Trigger
NO
NO
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
YES
Technology
CMOS
TTL
Temperature Grade
MILITARY
INDUSTRIAL
Terminal Form
THROUGH-HOLE
GULL WING
Terminal Pitch
2.54 mm
1.27 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
30
Base Number Matches
2
2
Part Package Code
SOIC
Pin Count
14
Manufacturer Package Code
SOT108-1
Family
F/FAST
JESD-609 Code
e4
Length
8.65 mm
Moisture Sensitivity Level
1
Number of Functions
4
Number of Inputs
2
Packing Method
TR
Power Supply Current-Max (ICC)
15.5 mA
Propagation Delay (tpd)
6.6 ns
Seated Height-Max
1.75 mm
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
Width
3.9 mm
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