5962-01-282-3059
vs
HEF4011UBDF
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Contact Manufacturer
|
Obsolete
|
| Ihs Manufacturer |
RENESAS ELECTRONICS CORP
|
NXP SEMICONDUCTORS
|
| Package Description |
,
|
DIP,
|
| Reach Compliance Code |
not_compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Base Number Matches |
2
|
1
|
| Part Package Code |
|
DIP
|
| Pin Count |
|
14
|
| Family |
|
4000/14000/40000
|
| JESD-30 Code |
|
R-GDIP-T14
|
| Load Capacitance (CL) |
|
50 pF
|
| Logic IC Type |
|
NAND GATE
|
| Number of Functions |
|
4
|
| Number of Inputs |
|
2
|
| Number of Terminals |
|
14
|
| Operating Temperature-Max |
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Package Body Material |
|
CERAMIC, GLASS-SEALED
|
| Package Code |
|
DIP
|
| Package Shape |
|
RECTANGULAR
|
| Package Style |
|
IN-LINE
|
| Propagation Delay (tpd) |
|
120 ns
|
| Seated Height-Max |
|
5.08 mm
|
| Supply Voltage-Max (Vsup) |
|
15 V
|
| Supply Voltage-Min (Vsup) |
|
3 V
|
| Supply Voltage-Nom (Vsup) |
|
5 V
|
| Surface Mount |
|
NO
|
| Technology |
|
CMOS
|
| Temperature Grade |
|
INDUSTRIAL
|
| Terminal Form |
|
THROUGH-HOLE
|
| Terminal Pitch |
|
2.54 mm
|
| Terminal Position |
|
DUAL
|
| Width |
|
7.62 mm
|
|
|
|
Compare 5962-01-282-3059 with alternatives
Compare HEF4011UBDF with alternatives