5962-01-241-7364
vs
MC14002BCL
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Contact Manufacturer
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
MOTOROLA SEMICONDUCTOR PRODUCTS
Package Description
DIP, DIP14,.3
DIP, DIP14,.3
Reach Compliance Code
compliant
unknown
HTS Code
8542.39.00.01
JESD-30 Code
R-PDIP-T14
R-XDIP-T14
JESD-609 Code
e3
e0
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
AND GATE
NOR GATE
Max I(ol)
0.00035999999999999997 A
Moisture Sensitivity Level
1
Number of Terminals
14
14
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-55 °C
Package Body Material
PLASTIC/EPOXY
CERAMIC
Package Code
DIP
DIP
Package Equivalence Code
DIP14,.3
DIP14,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Prop. Delay@Nom-Sup
120 ns
300 ns
Qualification Status
Not Qualified
Not Qualified
Schmitt Trigger
NO
NO
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
MILITARY
Terminal Finish
MATTE TIN
Tin/Lead (Sn/Pb)
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Base Number Matches
1
4
Power Supplies
5/15 V
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