5962-01-167-7868 vs TLV2354MJ feature comparison

5962-01-167-7868 AMD

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TLV2354MJ Texas Instruments

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer ADVANCED MICRO DEVICES INC TEXAS INSTRUMENTS INC
Package Description DIP, DIP14,.3 DIP, DIP14,.3
Reach Compliance Code compliant not_compliant
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Amplifier Type COMPARATOR COMPARATOR
Input Offset Voltage-Max 9000 µV 10000 µV
JESD-30 Code R-XDIP-T14 R-GDIP-T14
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Body Material CERAMIC CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Equivalence Code DIP14,.3 DIP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Not Qualified Not Qualified
Response Time-Nom 1300 ns 1400 ns
Screening Level MIL-STD-883 Class C
Supply Current-Max 2 mA 0.8 mA
Supply Voltage-Nom (Vsup) 5 V 3 V
Surface Mount NO NO
Technology BIPOLAR CMOS
Temperature Grade MILITARY MILITARY
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Base Number Matches 1 1
Pbfree Code No
Part Package Code DIP
Pin Count 14
Average Bias Current-Max (IIB) 0.02 µA
Length 19.56 mm
Number of Functions 4
Output Type OPEN-DRAIN
Peak Reflow Temperature (Cel) NOT SPECIFIED
Seated Height-Max 5.08 mm
Supply Voltage Limit-Max 8 V
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 7.62 mm

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