5962-01-077-8809
vs
HEF4512BD
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Contact Manufacturer
|
Transferred
|
| Ihs Manufacturer |
RENESAS ELECTRONICS CORP
|
PHILIPS SEMICONDUCTORS
|
| Package Description |
,
|
DIP, DIP16,.3
|
| Reach Compliance Code |
not_compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Base Number Matches |
2
|
2
|
| JESD-30 Code |
|
R-XDIP-T16
|
| JESD-609 Code |
|
e0
|
| Load Capacitance (CL) |
|
50 pF
|
| Logic IC Type |
|
MULTIPLEXER
|
| Max I(ol) |
|
0.00035999999999999997 A
|
| Number of Functions |
|
1
|
| Number of Inputs |
|
8
|
| Number of Terminals |
|
16
|
| Operating Temperature-Max |
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Output Characteristics |
|
3-STATE
|
| Package Body Material |
|
CERAMIC
|
| Package Code |
|
DIP
|
| Package Equivalence Code |
|
DIP16,.3
|
| Package Shape |
|
RECTANGULAR
|
| Package Style |
|
IN-LINE
|
| Prop. Delay@Nom-Sup |
|
300 ns
|
| Surface Mount |
|
NO
|
| Technology |
|
CMOS
|
| Temperature Grade |
|
INDUSTRIAL
|
| Terminal Finish |
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
|
THROUGH-HOLE
|
| Terminal Pitch |
|
2.54 mm
|
| Terminal Position |
|
DUAL
|
|
|
|
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