5962-01-071-4863 vs HEF40174BDF feature comparison

5962-01-071-4863 Renesas Electronics Corporation

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HEF40174BDF NXP Semiconductors

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Rohs Code No
Part Life Cycle Code Contact Manufacturer Obsolete
Ihs Manufacturer RENESAS ELECTRONICS CORP NXP SEMICONDUCTORS
Package Description , DIP,
Reach Compliance Code not_compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Qualification Status Not Qualified Not Qualified
Base Number Matches 2 1
Part Package Code DIP
Pin Count 16
Family 4000/14000/40000
JESD-30 Code R-GDIP-T16
Load Capacitance (CL) 50 pF
Logic IC Type D FLIP-FLOP
Number of Bits 6
Number of Functions 1
Number of Terminals 16
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Output Polarity TRUE
Package Body Material CERAMIC, GLASS-SEALED
Package Code DIP
Package Shape RECTANGULAR
Package Style IN-LINE
Propagation Delay (tpd) 155 ns
Seated Height-Max 5.08 mm
Supply Voltage-Max (Vsup) 15 V
Supply Voltage-Min (Vsup) 3 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL
Trigger Type POSITIVE EDGE
Width 7.62 mm
fmax-Min 5 MHz

Compare 5962-01-071-4863 with alternatives

Compare HEF40174BDF with alternatives