5962-005401-QXX
vs
TSC695F-25MB-E
feature comparison
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
ATMEL CORP
|
ATMEL CORP
|
| Part Package Code |
QFP
|
QFP
|
| Package Description |
QFF,
|
QFF, DIE OR CHIP
|
| Pin Count |
256
|
256
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
3A001.A.2.C
|
3A991.A.2
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Address Bus Width |
32
|
32
|
| Bit Size |
32
|
32
|
| Boundary Scan |
YES
|
YES
|
| Clock Frequency-Max |
25 MHz
|
50 MHz
|
| External Data Bus Width |
32
|
32
|
| Format |
FLOATING POINT
|
FLOATING POINT
|
| Integrated Cache |
NO
|
NO
|
| JESD-30 Code |
S-PQFP-F256
|
S-PQFP-F256
|
| Length |
37.085 mm
|
37.085 mm
|
| Low Power Mode |
YES
|
YES
|
| Number of Terminals |
256
|
256
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
QFF
|
QFF
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK
|
FLATPACK
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Screening Level |
MIL-PRF-38535 Class Q
|
|
| Seated Height-Max |
3.18 mm
|
3.18 mm
|
| Speed |
25 MHz
|
25 MHz
|
| Supply Voltage-Max |
5.5 V
|
5.5 V
|
| Supply Voltage-Min |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
MILITARY
|
| Terminal Form |
FLAT
|
FLAT
|
| Terminal Pitch |
0.508 mm
|
0.508 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
37.085 mm
|
37.085 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR, RISC
|
| Base Number Matches |
2
|
2
|
| Pbfree Code |
|
No
|
| Rohs Code |
|
No
|
| Moisture Sensitivity Level |
|
1
|
| Package Equivalence Code |
|
DIE OR CHIP
|
| Supply Current-Max |
|
230 mA
|
| Total Dose |
|
300k Rad(Si) V
|
|
|
|
Compare 5962-005401-QXX with alternatives
Compare TSC695F-25MB-E with alternatives