5962-0050901QFX
vs
74LVC157ABQ,115
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
TEXAS INSTRUMENTS INC
NXP SEMICONDUCTORS
Part Package Code
DFP
QFN
Package Description
QFF,
2.50 X 3.50 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT-763-1, DHVQFN-16
Pin Count
16
16
Reach Compliance Code
compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Family
LVC/LCX/Z
LVC/LCX/Z
JESD-30 Code
R-GDFP-F16
R-PQCC-N16
Length
10.2 mm
3.5 mm
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
MULTIPLEXER
MULTIPLEXER
Max I(ol)
0.024 A
0.024 A
Number of Functions
4
4
Number of Inputs
2
2
Number of Outputs
1
1
Number of Terminals
16
16
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-40 °C
Output Characteristics
3-STATE
Output Polarity
TRUE
TRUE
Package Body Material
CERAMIC, GLASS-SEALED
PLASTIC/EPOXY
Package Code
QFF
HVQCCN
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
FLATPACK
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Cel)
NOT SPECIFIED
260
Prop. Delay@Nom-Sup
5.4 ns
6.5 ns
Propagation Delay (tpd)
5.4 ns
7.5 ns
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-PRF-38535 Class Q
Seated Height-Max
2.03 mm
1 mm
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
2 V
1.2 V
Supply Voltage-Nom (Vsup)
2.7 V
2.7 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
AUTOMOTIVE
Terminal Form
FLAT
NO LEAD
Terminal Pitch
1.27 mm
0.5 mm
Terminal Position
DUAL
QUAD
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
30
Width
6.73 mm
2.5 mm
Base Number Matches
1
2
Rohs Code
Manufacturer Package Code
SOT763-1
Factory Lead Time
4 Weeks
JESD-609 Code
e4
Moisture Sensitivity Level
1
Package Equivalence Code
LCC16,.1X.14,20
Packing Method
TR
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
Compare 5962-0050901QFX with alternatives
Compare 74LVC157ABQ,115 with alternatives