553MI vs 5T30553DCGI feature comparison

553MI Integrated Device Technology Inc

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5T30553DCGI Integrated Device Technology Inc

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Rohs Code No Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code SOIC SOIC
Package Description 0.150 INCH, SOIC-8 SOIC-8
Pin Count 8 8
Reach Compliance Code not_compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family 553 5T
Input Conditioning STANDARD STANDARD
JESD-30 Code R-PDSO-G8 R-PDSO-G8
JESD-609 Code e0 e3
Length 4.9 mm 4.9 mm
Logic IC Type LOW SKEW CLOCK DRIVER PLL BASED CLOCK DRIVER
Max I(ol) 0.035 A 0.025 A
Moisture Sensitivity Level 1 1
Number of Functions 1 1
Number of Inverted Outputs
Number of Terminals 8 8
Number of True Outputs 4 4
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Equivalence Code SOP8,.25 SOP8,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Peak Reflow Temperature (Cel) 240 260
Propagation Delay (tpd) 5 ns 5 ns
Qualification Status Not Qualified Not Qualified
Same Edge Skew-Max (tskwd) 0.05 ns 0.5 ns
Seated Height-Max 1.75 mm 1.75 mm
Supply Voltage-Max (Vsup) 5.25 V 3.45 V
Supply Voltage-Min (Vsup) 2.375 V 2.375 V
Supply Voltage-Nom (Vsup) 2.5 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD MATTE TIN
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 20 30
Width 3.9 mm 3.9 mm
fmax-Min 200 MHz
Base Number Matches 1 2
Pbfree Code Yes
Manufacturer Package Code DCG8
ECCN Code EAR99
Additional Feature IT CAN ALSO OPERATE AT 3.3V SUPPLY
Prop. Delay@Nom-Sup 5 ns

Compare 553MI with alternatives

Compare 5T30553DCGI with alternatives