54SHSC74CE vs 54HSC74FS feature comparison

54SHSC74CE Dynex Semiconductor

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54HSC74FS Dynex Semiconductor

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer GEC PLESSEY SEMICONDUCTORS GEC PLESSEY SEMICONDUCTORS
Package Description , DFP, FL14,.3
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature RADIATION HARD CMOS/SILICON ON SAPPHIRE (SOS) TECHNOLOGY RADIATION HARD CMOS/SILICON ON SAPPHIRE (SOS) TECHNOLOGY
Family HSC HSC
JESD-30 Code R-CDIP-T14 R-CDFP-F14
Logic IC Type D FLIP-FLOP D FLIP-FLOP
Number of Bits 1 1
Number of Functions 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Output Polarity COMPLEMENTARY COMPLEMENTARY
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package Code DIP DFP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE FLATPACK
Propagation Delay (tpd) 25 ns 25 ns
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Form THROUGH-HOLE FLAT
Terminal Position DUAL DUAL
Trigger Type POSITIVE EDGE POSITIVE EDGE
Base Number Matches 1 1
Rohs Code No
JESD-609 Code e0
Length 8.636 mm
Load Capacitance (CL) 50 pF
Max I(ol) 0.009 A
Package Equivalence Code FL14,.3
Prop. Delay@Nom-Sup 25 ns
Screening Level 38535V;38534K;883S
Seated Height-Max 2.667 mm
Terminal Finish TIN LEAD
Terminal Pitch 1.27 mm
Width 6.5 mm

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