54SHSC74CE
vs
54HSC74FS
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
GEC PLESSEY SEMICONDUCTORS
GEC PLESSEY SEMICONDUCTORS
Package Description
,
DFP, FL14,.3
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
RADIATION HARD CMOS/SILICON ON SAPPHIRE (SOS) TECHNOLOGY
RADIATION HARD CMOS/SILICON ON SAPPHIRE (SOS) TECHNOLOGY
Family
HSC
HSC
JESD-30 Code
R-CDIP-T14
R-CDFP-F14
Logic IC Type
D FLIP-FLOP
D FLIP-FLOP
Number of Bits
1
1
Number of Functions
2
2
Number of Terminals
14
14
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Output Polarity
COMPLEMENTARY
COMPLEMENTARY
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Code
DIP
DFP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
FLATPACK
Propagation Delay (tpd)
25 ns
25 ns
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Form
THROUGH-HOLE
FLAT
Terminal Position
DUAL
DUAL
Trigger Type
POSITIVE EDGE
POSITIVE EDGE
Base Number Matches
1
1
Rohs Code
No
JESD-609 Code
e0
Length
8.636 mm
Load Capacitance (CL)
50 pF
Max I(ol)
0.009 A
Package Equivalence Code
FL14,.3
Prop. Delay@Nom-Sup
25 ns
Screening Level
38535V;38534K;883S
Seated Height-Max
2.667 mm
Terminal Finish
TIN LEAD
Terminal Pitch
1.27 mm
Width
6.5 mm
Compare 54SHSC74CE with alternatives
Compare 54HSC74FS with alternatives