54SHSC253FB
vs
54HHSC253NB
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
GEC PLESSEY SEMICONDUCTORS
GEC PLESSEY SEMICONDUCTORS
Package Description
DFP, FL16,.3
,
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
HSC
HSC
JESD-30 Code
R-CDFP-F16
X-XUUC-N
JESD-609 Code
e0
Length
10.16 mm
Logic IC Type
MULTIPLEXER
MULTIPLEXER
Max I(ol)
0.009 A
Number of Functions
2
2
Number of Inputs
4
4
Number of Outputs
1
1
Number of Terminals
16
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Output Characteristics
3-STATE
3-STATE
Output Polarity
TRUE
TRUE
Package Body Material
CERAMIC, METAL-SEALED COFIRED
UNSPECIFIED
Package Code
DFP
DIE
Package Equivalence Code
FL16,.3
DIE OR CHIP
Package Shape
RECTANGULAR
UNSPECIFIED
Package Style
FLATPACK
UNCASED CHIP
Prop. Delay@Nom-Sup
25 ns
Propagation Delay (tpd)
25 ns
25 ns
Qualification Status
Not Qualified
Not Qualified
Screening Level
38535Q/M;38534H;883B
Seated Height-Max
2.61 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Finish
Tin/Lead (Sn/Pb)
Terminal Form
FLAT
NO LEAD
Terminal Pitch
1.27 mm
Terminal Position
DUAL
UPPER
Width
6.85 mm
Base Number Matches
2
1
Compare 54SHSC253FB with alternatives
Compare 54HHSC253NB with alternatives