54RHST253FD
vs
SN74LS157NS
feature comparison
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
GEC PLESSEY SEMICONDUCTORS
|
MOTOROLA INC
|
Package Description |
,
|
PLASTIC, DIP-16
|
Reach Compliance Code |
unknown
|
unknown
|
Family |
HST/T
|
LS
|
JESD-30 Code |
R-CDFP-F16
|
R-PDIP-T16
|
Load Capacitance (CL) |
50 pF
|
|
Logic IC Type |
MULTIPLEXER
|
MULTIPLEXER
|
Number of Functions |
2
|
4
|
Number of Inputs |
4
|
2
|
Number of Outputs |
1
|
1
|
Number of Terminals |
16
|
16
|
Operating Temperature-Max |
125 °C
|
70 °C
|
Operating Temperature-Min |
-55 °C
|
|
Output Characteristics |
3-STATE
|
|
Output Polarity |
TRUE
|
TRUE
|
Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
PLASTIC/EPOXY
|
Package Code |
DFP
|
DIP
|
Package Equivalence Code |
FL16,.3
|
DIP16,.3
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
FLATPACK
|
IN-LINE
|
Propagation Delay (tpd) |
25 ns
|
27 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Supply Voltage-Max (Vsup) |
5.5 V
|
5.25 V
|
Supply Voltage-Min (Vsup) |
4.5 V
|
4.75 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
YES
|
NO
|
Technology |
CMOS
|
TTL
|
Temperature Grade |
MILITARY
|
COMMERCIAL
|
Terminal Form |
FLAT
|
THROUGH-HOLE
|
Terminal Position |
DUAL
|
DUAL
|
Base Number Matches |
2
|
3
|
Rohs Code |
|
No
|
HTS Code |
|
8542.39.00.01
|
JESD-609 Code |
|
e0
|
Length |
|
20.07 mm
|
Seated Height-Max |
|
5.08 mm
|
Terminal Finish |
|
TIN LEAD
|
Terminal Pitch |
|
2.54 mm
|
Width |
|
7.62 mm
|
|
|
|
Compare 54RHST253FD with alternatives
Compare SN74LS157NS with alternatives