54RHST253FD vs SN74LS157NS feature comparison

54RHST253FD Plessey Semiconductors Ltd

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SN74LS157NS Motorola Semiconductor Products

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer GEC PLESSEY SEMICONDUCTORS MOTOROLA INC
Package Description , PLASTIC, DIP-16
Reach Compliance Code unknown unknown
Family HST/T LS
JESD-30 Code R-CDFP-F16 R-PDIP-T16
Load Capacitance (CL) 50 pF
Logic IC Type MULTIPLEXER MULTIPLEXER
Number of Functions 2 4
Number of Inputs 4 2
Number of Outputs 1 1
Number of Terminals 16 16
Operating Temperature-Max 125 °C 70 °C
Operating Temperature-Min -55 °C
Output Characteristics 3-STATE
Output Polarity TRUE TRUE
Package Body Material CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY
Package Code DFP DIP
Package Equivalence Code FL16,.3 DIP16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style FLATPACK IN-LINE
Propagation Delay (tpd) 25 ns 27 ns
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 5.5 V 5.25 V
Supply Voltage-Min (Vsup) 4.5 V 4.75 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES NO
Technology CMOS TTL
Temperature Grade MILITARY COMMERCIAL
Terminal Form FLAT THROUGH-HOLE
Terminal Position DUAL DUAL
Base Number Matches 2 3
Rohs Code No
HTS Code 8542.39.00.01
JESD-609 Code e0
Length 20.07 mm
Seated Height-Max 5.08 mm
Terminal Finish TIN LEAD
Terminal Pitch 2.54 mm
Width 7.62 mm

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