54QHSC74CS
vs
54HSC74NB
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
GEC PLESSEY SEMICONDUCTORS
|
GEC PLESSEY SEMICONDUCTORS
|
| Package Description |
DIP, DIP14,.3
|
DIE,
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Additional Feature |
RADIATION HARD CMOS/SILICON ON SAPPHIRE (SOS) TECHNOLOGY
|
RADIATION HARD CMOS/SILICON ON SAPPHIRE (SOS) TECHNOLOGY
|
| Family |
HSC
|
HSC
|
| JESD-30 Code |
R-CDIP-T14
|
X-XUUC-N
|
| JESD-609 Code |
e0
|
|
| Load Capacitance (CL) |
50 pF
|
|
| Logic IC Type |
D FLIP-FLOP
|
D FLIP-FLOP
|
| Max I(ol) |
0.009 A
|
|
| Number of Bits |
1
|
1
|
| Number of Functions |
2
|
2
|
| Number of Terminals |
14
|
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Output Polarity |
COMPLEMENTARY
|
COMPLEMENTARY
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
UNSPECIFIED
|
| Package Code |
DIP
|
DIE
|
| Package Equivalence Code |
DIP14,.3
|
|
| Package Shape |
RECTANGULAR
|
UNSPECIFIED
|
| Package Style |
IN-LINE
|
UNCASED CHIP
|
| Prop. Delay@Nom-Sup |
25 ns
|
|
| Propagation Delay (tpd) |
25 ns
|
25 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Screening Level |
38535V;38534K;883S
|
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
MILITARY
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
THROUGH-HOLE
|
NO LEAD
|
| Terminal Pitch |
2.54 mm
|
|
| Terminal Position |
DUAL
|
UPPER
|
| Total Dose |
300k Rad(Si) V
|
|
| Trigger Type |
POSITIVE EDGE
|
POSITIVE EDGE
|
| Base Number Matches |
2
|
1
|
| Part Package Code |
|
DIE
|
|
|
|
Compare 54QHSC74CS with alternatives
Compare 54HSC74NB with alternatives