54QHSC573FD
vs
54HHSC573FB
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
GEC PLESSEY SEMICONDUCTORS
|
GEC PLESSEY SEMICONDUCTORS
|
| Package Description |
,
|
DFP, FL20,.3
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Additional Feature |
BROADSIDE VERSION OF 373; RADIATION HARD CMOS/SILICON ON SAPPHIRE (SOS) TECHNOLOGY
|
BROADSIDE VERSION OF 373; RADIATION HARD CMOS/SILICON ON SAPPHIRE (SOS) TECHNOLOGY
|
| Family |
HSC
|
HSC
|
| JESD-30 Code |
R-CDFP-F20
|
R-CDFP-F20
|
| Load Capacitance (CL) |
50 pF
|
50 pF
|
| Logic IC Type |
BUS DRIVER
|
BUS DRIVER
|
| Number of Bits |
8
|
8
|
| Number of Functions |
1
|
1
|
| Number of Ports |
2
|
2
|
| Number of Terminals |
20
|
20
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Output Polarity |
TRUE
|
TRUE
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
DFP
|
DFP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
FLATPACK
|
FLATPACK
|
| Propagation Delay (tpd) |
29 ns
|
29 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
MILITARY
|
| Terminal Form |
FLAT
|
FLAT
|
| Terminal Position |
DUAL
|
DUAL
|
| Base Number Matches |
1
|
1
|
| Rohs Code |
|
No
|
| JESD-609 Code |
|
e0
|
| Length |
|
12.2 mm
|
| Max I(ol) |
|
0.009 A
|
| Package Equivalence Code |
|
FL20,.3
|
| Prop. Delay@Nom-Sup |
|
29 ns
|
| Screening Level |
|
38535Q/M;38534H;883B
|
| Seated Height-Max |
|
2.7 mm
|
| Terminal Finish |
|
TIN LEAD
|
| Terminal Pitch |
|
1.27 mm
|
| Total Dose |
|
1M Rad(Si) V
|
| Width |
|
7.5 mm
|
|
|
|
Compare 54QHSC573FD with alternatives
Compare 54HHSC573FB with alternatives