54QHSC253NC vs 54HHSC253CB feature comparison

54QHSC253NC Dynex Semiconductor

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54HHSC253CB Dynex Semiconductor

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer GEC PLESSEY SEMICONDUCTORS GEC PLESSEY SEMICONDUCTORS
Package Description , DIP, DIP16,.3
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family HSC HSC
JESD-30 Code X-XUUC-N R-CDIP-T16
Logic IC Type MULTIPLEXER MULTIPLEXER
Number of Functions 2 2
Number of Inputs 4 4
Number of Outputs 1 1
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE TRUE
Package Body Material UNSPECIFIED CERAMIC, METAL-SEALED COFIRED
Package Code DIE DIP
Package Equivalence Code DIE OR CHIP DIP16,.3
Package Shape UNSPECIFIED RECTANGULAR
Package Style UNCASED CHIP IN-LINE
Propagation Delay (tpd) 25 ns 25 ns
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Form NO LEAD THROUGH-HOLE
Terminal Position UPPER DUAL
Base Number Matches 1 2
Rohs Code No
JESD-609 Code e0
Length 20.58 mm
Load Capacitance (CL) 50 pF
Max I(ol) 0.009 A
Number of Terminals 16
Prop. Delay@Nom-Sup 25 ns
Screening Level 38535Q/M;38534H;883B
Seated Height-Max 5.6 mm
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Pitch 2.54 mm
Total Dose 1M Rad(Si) V
Width 7.62 mm

Compare 54QHSC253NC with alternatives

Compare 54HHSC253CB with alternatives