54LS75/BEAJC
vs
74LS75F
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
MOTOROLA SEMICONDUCTOR PRODUCTS
|
SIGNETICS CORP
|
| Package Description |
DIP, DIP16,.3
|
,
|
| Reach Compliance Code |
unknown
|
unknown
|
| JESD-30 Code |
R-XDIP-T16
|
R-GDIP-T16
|
| JESD-609 Code |
e0
|
|
| Logic IC Type |
D LATCH
|
D LATCH
|
| Max I(ol) |
0.004 A
|
|
| Number of Bits |
4
|
2
|
| Number of Functions |
1
|
2
|
| Number of Terminals |
16
|
16
|
| Operating Temperature-Max |
125 °C
|
70 °C
|
| Operating Temperature-Min |
-55 °C
|
|
| Package Body Material |
CERAMIC
|
CERAMIC, GLASS-SEALED
|
| Package Code |
DIP
|
DIP
|
| Package Equivalence Code |
DIP16,.3
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Power Supplies |
5 V
|
|
| Power Supply Current-Max (ICC) |
12 mA
|
12 mA
|
| Prop. Delay@Nom-Sup |
46 ns
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Screening Level |
38535Q/M;38534H;883B
|
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
TTL
|
TTL
|
| Temperature Grade |
MILITARY
|
COMMERCIAL
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
|
| Terminal Position |
DUAL
|
DUAL
|
| Base Number Matches |
3
|
3
|
| HTS Code |
|
8542.39.00.01
|
| Family |
|
LS
|
| Load Capacitance (CL) |
|
15 pF
|
| Output Polarity |
|
COMPLEMENTARY
|
| Propagation Delay (tpd) |
|
25 ns
|
| Trigger Type |
|
HIGH LEVEL
|
|
|
|
Compare 74LS75F with alternatives