54LS366ADMQB
vs
935189920118
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
ROCHESTER ELECTRONICS INC
NXP SEMICONDUCTORS
Part Package Code
DIP
SOIC
Package Description
DIP,
PLASTIC, SSOP-16
Pin Count
16
16
Reach Compliance Code
unknown
unknown
Additional Feature
WITH DUAL OUTPUT ENABLE
Family
LS
HC/UH
JESD-30 Code
R-GDIP-T16
R-PDSO-G16
Length
19.43 mm
6.2 mm
Logic IC Type
BUS DRIVER
BUS DRIVER
Number of Bits
6
1
Number of Functions
1
6
Number of Ports
2
2
Number of Terminals
16
16
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-40 °C
Output Characteristics
3-STATE
3-STATE
Output Polarity
INVERTED
INVERTED
Package Body Material
CERAMIC, GLASS-SEALED
PLASTIC/EPOXY
Package Code
DIP
SSOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
SMALL OUTLINE, SHRINK PITCH
Propagation Delay (tpd)
22 ns
145 ns
Qualification Status
MILITARY
Not Qualified
Seated Height-Max
5.08 mm
2 mm
Supply Voltage-Max (Vsup)
5.5 V
6 V
Supply Voltage-Min (Vsup)
4.5 V
2 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
YES
Technology
TTL
CMOS
Temperature Grade
MILITARY
AUTOMOTIVE
Terminal Finish
NOT SPECIFIED
Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form
THROUGH-HOLE
GULL WING
Terminal Pitch
2.54 mm
0.65 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
5.3 mm
Base Number Matches
4
2
Pbfree Code
Rohs Code
HTS Code
8542.39.00.01
JESD-609 Code
e4
Moisture Sensitivity Level
1
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare 54LS366ADMQB with alternatives
Compare 935189920118 with alternatives