54LS295B/BCA
vs
N74LS295BN
feature comparison
Rohs Code |
No
|
|
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
PHILIPS SEMICONDUCTORS
|
NXP SEMICONDUCTORS
|
Package Description |
DIP-14
|
DIP, DIP14,.3
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Count Direction |
RIGHT
|
BIDIRECTIONAL
|
Family |
LS
|
LS
|
JESD-30 Code |
R-XDIP-T14
|
R-PDIP-T14
|
JESD-609 Code |
e0
|
e0
|
Load Capacitance (CL) |
50 pF
|
|
Logic IC Type |
PARALLEL IN PARALLEL OUT
|
PARALLEL IN PARALLEL OUT
|
Number of Bits |
4
|
4
|
Number of Functions |
1
|
1
|
Number of Terminals |
14
|
14
|
Operating Temperature-Max |
125 °C
|
70 °C
|
Operating Temperature-Min |
-55 °C
|
|
Output Characteristics |
3-STATE
|
3-STATE
|
Output Polarity |
TRUE
|
TRUE
|
Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
PLASTIC/EPOXY
|
Package Code |
DIP
|
DIP
|
Package Equivalence Code |
DIP14,.3
|
DIP14,.3
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
IN-LINE
|
IN-LINE
|
Power Supply Current-Max (ICC) |
29 mA
|
|
Propagation Delay (tpd) |
39 ns
|
30 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Screening Level |
38535Q/M;38534H;883B
|
|
Supply Voltage-Max (Vsup) |
5.5 V
|
5.25 V
|
Supply Voltage-Min (Vsup) |
4.5 V
|
4.75 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
NO
|
NO
|
Technology |
TTL
|
TTL
|
Temperature Grade |
MILITARY
|
COMMERCIAL
|
Terminal Finish |
Tin/Lead (Sn/Pb)
|
Tin/Lead (Sn/Pb)
|
Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
Terminal Pitch |
2.54 mm
|
2.54 mm
|
Terminal Position |
DUAL
|
DUAL
|
Trigger Type |
NEGATIVE EDGE
|
NEGATIVE EDGE
|
fmax-Min |
30 MHz
|
30 MHz
|
Base Number Matches |
3
|
4
|
Part Package Code |
|
DIP
|
Pin Count |
|
14
|
Length |
|
19.09 mm
|
Max Frequency@Nom-Sup |
|
30000000 Hz
|
Seated Height-Max |
|
4.06 mm
|
Width |
|
7.62 mm
|
|
|
|
Compare N74LS295BN with alternatives