54LS257A/BEAJC
vs
TC74AC158FN
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
MOTOROLA INC
TOSHIBA CORP
Part Package Code
DIP
SOIC
Package Description
DIP, DIP16,.3
SOP, SOP16,.25
Pin Count
16
16
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
LS
AC
JESD-30 Code
R-GDIP-T16
R-PDSO-G16
JESD-609 Code
e0
e0
Length
19.3 mm
9.9 mm
Logic IC Type
MULTIPLEXER
MULTIPLEXER
Max I(ol)
0.012 A
0.024 A
Number of Functions
4
4
Number of Inputs
2
2
Number of Outputs
1
1
Number of Terminals
16
16
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-55 °C
-40 °C
Output Characteristics
3-STATE
Output Polarity
TRUE
INVERTED
Package Body Material
CERAMIC, GLASS-SEALED
PLASTIC/EPOXY
Package Code
DIP
SOP
Package Equivalence Code
DIP16,.3
SOP16,.25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
SMALL OUTLINE
Power Supply Current-Max (ICC)
19 mA
Prop. Delay@Nom-Sup
21 ns
10.6 ns
Propagation Delay (tpd)
39 ns
10.5 ns
Qualification Status
Not Qualified
Not Qualified
Screening Level
38535Q/M;38534H;883B
Seated Height-Max
4.19 mm
1.75 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
2 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
YES
Technology
TTL
CMOS
Temperature Grade
MILITARY
INDUSTRIAL
Terminal Finish
TIN LEAD
Tin/Lead (Sn/Pb)
Terminal Form
THROUGH-HOLE
GULL WING
Terminal Pitch
2.54 mm
1.27 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
3.9 mm
Base Number Matches
3
1
Load Capacitance (CL)
50 pF
Compare 54LS257A/BEAJC with alternatives
Compare TC74AC158FN with alternatives