54LS112LMQB
vs
HD74LS76ARP
feature comparison
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
HITACHI LTD
|
| Package Description |
QCCN, LCC20,.35SQ
|
SOP, SOP16,.25
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Family |
LS
|
LS
|
| JESD-30 Code |
S-CQCC-N20
|
R-PDSO-G16
|
| Length |
8.89 mm
|
9.9 mm
|
| Load Capacitance (CL) |
15 pF
|
15 pF
|
| Logic IC Type |
J-K FLIP-FLOP
|
J-K FLIP-FLOP
|
| Max Frequency@Nom-Sup |
25000000 Hz
|
|
| Max I(ol) |
0.004 A
|
0.008 A
|
| Number of Bits |
2
|
2
|
| Number of Functions |
2
|
2
|
| Number of Terminals |
20
|
16
|
| Operating Temperature-Max |
125 °C
|
75 °C
|
| Operating Temperature-Min |
-55 °C
|
-20 °C
|
| Output Polarity |
COMPLEMENTARY
|
COMPLEMENTARY
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
PLASTIC/EPOXY
|
| Package Code |
QCCN
|
SOP
|
| Package Equivalence Code |
LCC20,.35SQ
|
SOP16,.25
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER
|
SMALL OUTLINE
|
| Power Supply Current-Max (ICC) |
6 mA
|
6 mA
|
| Propagation Delay (tpd) |
20 ns
|
20 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Screening Level |
38535Q/M;38534H;883B
|
|
| Seated Height-Max |
1.905 mm
|
1.75 mm
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
TTL
|
TTL
|
| Temperature Grade |
MILITARY
|
COMMERCIAL EXTENDED
|
| Terminal Form |
NO LEAD
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
QUAD
|
DUAL
|
| Trigger Type |
NEGATIVE EDGE
|
NEGATIVE EDGE
|
| Width |
8.89 mm
|
3.95 mm
|
| fmax-Min |
30 MHz
|
30 MHz
|
| Base Number Matches |
4
|
2
|
| Part Package Code |
|
SOIC
|
| Pin Count |
|
16
|
| Prop. Delay@Nom-Sup |
|
20 ns
|
|
|
|
Compare 54LS112LMQB with alternatives
Compare HD74LS76ARP with alternatives