54LS112LMQB vs 74HC174D-T feature comparison

54LS112LMQB Rochester Electronics LLC

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74HC174D-T NXP Semiconductors

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Part Life Cycle Code Contact Manufacturer Obsolete
Ihs Manufacturer ROCHESTER ELECTRONICS LLC NXP SEMICONDUCTORS
Part Package Code QLCC SOIC
Package Description CERAMIC, LCC-20 SOP, SOP16,.25
Pin Count 20 16
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family LS HC/UH
JESD-30 Code S-CQCC-N20 R-PDSO-G16
Length 8.89 mm 9.9 mm
Logic IC Type J-K FLIP-FLOP D FLIP-FLOP
Number of Bits 2 6
Number of Functions 2 1
Number of Terminals 20 16
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -40 °C
Output Polarity COMPLEMENTARY TRUE
Package Body Material CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY
Package Code QCCN SOP
Package Shape SQUARE RECTANGULAR
Package Style CHIP CARRIER SMALL OUTLINE
Propagation Delay (tpd) 20 ns 50 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.905 mm 1.75 mm
Supply Voltage-Max (Vsup) 5.5 V 6 V
Supply Voltage-Min (Vsup) 4.5 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology TTL CMOS
Temperature Grade MILITARY AUTOMOTIVE
Terminal Form NO LEAD GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position QUAD DUAL
Trigger Type NEGATIVE EDGE POSITIVE EDGE
Width 8.89 mm 3.9 mm
fmax-Min 30 MHz 20 MHz
Base Number Matches 4 2
Pbfree Code Yes
Rohs Code Yes
JESD-609 Code e4
Load Capacitance (CL) 50 pF
Max Frequency@Nom-Sup 24000000 Hz
Max I(ol) 0.004 A
Moisture Sensitivity Level 1
Package Equivalence Code SOP16,.25
Packing Method TR
Peak Reflow Temperature (Cel) 260
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Time@Peak Reflow Temperature-Max (s) 30

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